Rack for computing equipment

ABSTRACT

Provided is a datacenter chamber having racks configured to hold arrays of rack-mounted computing devices. The datacenter chamber comprises three or more racks, each rack having a plurality of receptacles configured to hold a computing device; a chassis configured to secure each of the racks in spaced relation relative to one another, wherein the chassis is configured to secure the racks facing outward from an interior chamber defined by a back-side of the racks, and wherein the chassis is configured to position the racks facing at least three different directions; and an integrated cooling system configured to drive a cooling fluid along computing devices mounted in the racks and through the interior chamber.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of the following U.S.Provisional Patent Applications: U.S. 62/130,018, filed 9 Mar. 2015;U.S. 62/248,788, filed 30 Oct. 2015; and U.S. 62/275,909, filed 7 Jan.2016. The entire content of each parent application is incorporated byreference in its entirety.

BACKGROUND

1. Field

The present invention relates generally to computing equipment and, morespecifically to racks for computing equipment.

2. Description of the Related Art

Computer racks, such as server racks, are generally used to house and insome cases interconnect collections of computing devices, like serversand associated storage, power supplies, network switches, and the like.In many cases, the computing devices are relatively numerous andarranged in a relatively high-density array due to the cost of spaceappropriate to store such computing devices and the desire to reducelatency by having the devices close to one another. Often the computingdevices generate a relatively large amount of heat during operation, andcooling the computing devices can be energy intensive. Indeed, in manycases, cooling costs account for a substantial portion of the cost ofrunning such devices. Such devices also present other challengesrelating to reliability, installation, component costs, and the like,each of which can add to the cost of providing computing services, e.g.,in a datacenter having a relatively large number of such computer racks.

SUMMARY

The following is a non-exhaustive listing of some aspects of the presenttechniques. These and other aspects are described in the followingdisclosure.

Some aspects include a datacenter chamber having racks configured tohold arrays of rack-mounted computing devices. The datacenter rackcomprises three or more racks, each rack having a plurality ofreceptacles configured to hold a computing device; a chassis configuredto secure each of the racks in spaced relation relative to one another,wherein the chassis is configured to secure the racks facing outwardfrom an interior chamber defined by a back-side of the racks, andwherein the chassis is configured to position the racks facing at leastthree different directions; and an integrated cooling system configuredto drive a cooling fluid along computing devices mounted in the racksand through the interior chamber.

BRIEF DESCRIPTION OF THE DRAWINGS

The above-mentioned aspects and other aspects of the present techniqueswill be better understood when the present application is read in viewof the following figures in which like numbers indicate similar oridentical elements:

FIG. 1 illustrates an example of a cylindrical datacenter chamber, inaccordance with some embodiments;

FIG. 2 illustrates a datacenter having an array of cylindricaldatacenter chambers of FIG. 1, in accordance with some embodiments;

FIGS. 3-4 illustrate operation of the cylindrical datacenter chamber ofFIG. 1, in accordance with some embodiments;

FIG. 5 illustrates examples of components of the cylindrical datacenterchamber of FIG. 1, in accordance with some embodiments;

FIG. 6 illustrates a chassis of the cylindrical datacenter chamber ofFIG. 1, in accordance with some embodiments;

FIG. 7 illustrates a wedge rack of the cylindrical datacenter chamber ofFIG. 1, in accordance with some embodiments;

FIGS. 8-10 illustrate examples of components of the wedge rack of thecylindrical datacenter chamber of FIG. 1, in accordance with someembodiments;

FIG. 11 illustrates a leveling base for the wedge racks of thecylindrical datacenter chamber of FIG. 1, in accordance with someembodiments;

FIG. 12 is a bottom view of the leveling base of FIG. 11, in accordancewith some embodiments;

FIG. 13 is a view of a portion of the leveling base of FIG. 11, inaccordance with some embodiments; and

FIG. 14 illustrates components of a computing device that may bedisposed and interconnected in the cylindrical datacenter chamber ofFIG. 1.

While the invention is susceptible to various modifications andalternative forms, specific embodiments thereof are shown by way ofexample in the drawings and will herein be described in detail. Thedrawings may not be to scale. It should be understood, however, that thedrawings and detailed description thereto are not intended to limit theinvention to the particular form disclosed, but to the contrary, theintention is to cover all modifications, equivalents, and alternativesfalling within the spirit and scope of the present invention as definedby the appended claims.

DETAILED DESCRIPTION OF CERTAIN EMBODIMENTS

To mitigate the problems described herein, the inventors had to bothinvent solutions and, in some cases just as importantly, recognizeproblems overlooked (or not yet foreseen) by others in the field of datacenter design. Indeed, the inventors wish to emphasize the difficulty ofrecognizing those problems that are nascent and will become much moreapparent in the future should trends in the data center industrycontinue as applicants expect. Further, because multiple problems areaddressed, it should be understood that some embodiments areproblem-specific, and not all embodiments address every problem withtraditional systems described herein or provide every benefit describedherein. That said, improvements that solve various permutations of theseproblems are described below.

FIG. 1 depicts an embodiment of a datacenter chamber 500 in accordancewith the present techniques. In some embodiments, datacenter 500includes a collection of adjacent racks arrayed non-linearly (e.g., in acircle, oval, square, etc.) so as to at least partially define aninterior chamber (e.g., by fully enclosing the interior chamber in ahorizontal plane, or by partially enclosing the interior chamber, likeby defining a concave area in the plane). The interior chamber defines acompartment through which cooling fluid flows, in some cases having asubstantially an empty space through which cooling fluid like air mayflow. Some embodiments may provide for a generally cylindricaldatacenter chamber 500, having a plurality of wedge racks, each with astack of vertically arrayed, outward facing servers. Wedge-shaped racksgenerally have an outer portion (further from the interior chamber) thatis wider than an inner portion (adjacent the interior chamber). Thisarrangement is expected to allow for relatively easy access to equipmenton the wedge racks (e.g., for maintenance, cabling, installation, etc.)An integrated cooling or ventilation system may be provided by which airis drawn or pushed through the inner chamber (e.g., via fans near thetop or bottom of the inner chamber as shown in FIGS. 3-4 and describedbelow). Additionally or alternatively, in some embodiments, ducting maybe coupled to the column, the data center pressurized, and air may flowthrough the ducting to a region at a lower pressure (or the ducting maybe driven to a lower pressure than a data center at ambient airpressure). Finally, arranging can be challenging due to the weight ofthe racks, particularly when the body of the racks serves to constrainand direct airflow, often leading to relatively narrow tolerances formating between adjacent racks. Some embodiments may include a guidingand seating system for aligning the racks during assembly, as describedbelow.

In some cases, the chamber may form a relatively self-contained unit,having cooling infrastructure independent of building-provided heating,ventilation, and air conditioning (HVAC). In some cases, the chamber mayalso have power conditioning circuitry (e.g., rectifiers, low-passfilters, and surge-protectors) and back-up power supplies (e.g.,batteries). In some embodiments, each chamber includes an integrated,self-contained compute fabric by which computing devices areinterconnected. A relatively self-contained chamber 500 as describedabove may provide benefits such as easy shipping, easy access tocomponents within the chamber, cost effective heat and humidity control,and independency from other infrastructure (e.g., datacenter building,other datacenter units, etc.). That said, several independently usefulinventions are described, so not all embodiments provide all of thesebenefits.

FIG. 1 shows an example of a chamber 500 including a plurality of racks505 configured to hold arrays of rack-mounted computing devices 514.Racks 505 are arranged non-linearly (e.g., in a rotationally symmetricarray) to define chamber 500 and the interior chamber (shown in laterviews). Racks 505, in some embodiments, are “wedge racks” shaped todefine the interior chamber when placed adjacent one another, forinstance, by forming a wedge-shape in their horizontal cross section. Insome embodiments, wedge racks 505 may be arranged into a shape such as atriangle, square, hexagon, or octagon with the back sides all facingtowards (and in some cases partially or entirely defining) the interiorchamber. In some embodiments, the chamber 500 may have a generallycylindrical shape, e.g., a circular cylindrical shape. In someembodiments, the chamber 500 may be generally rotationally symmetricabout a vertical axis extending through the center of the chamber 500.In some embodiments, the interior chamber of datacenter chamber 500(shown in FIGS. 3 and 4) may generally be of cylindrical shape. In somecases, the interior chamber of datacenter chamber 500 may define (e.g.,approximate) a right cylinder with a base having a variety of shapesconsistent with the present techniques, e.g., a rectangular, triangular,pentagonal, hexagonal, heptagonal, octagonal, decagonal, dodecagonal, orelliptical. In some cases, the interior chamber may define a taperedshape, such as an inverted cone, in which the diameter of the bottom islarger than the top or vice versa.

In some embodiments, chamber 500 provides front side rack access (theouter perimeter of the chamber) to access three categories ofinformation technology interfaces (e.g., of computing devices 514):compute; network, and storage. In some embodiments, the components bywhich the computing devices are connected to power and one another maybe accessible from the exterior of the chamber, e.g., the inner columnmay be generally or fully devoid of such connections, or alternateconnections may be accessible from the exterior. (Or some embodimentsmay include such connections in the interior.)

In some embodiments, a lid 510 is configured to fit on top of the wedgeracks. Lid may include an upper portion 520 and a lower portion 516 (onthe opposite side of the upper portion vertically) and an illuminationstrip 518, behind which may reside an array of light emitting diodesconnected to a rack controller. Light color, intensity, and flashingrates or patterns may indicate status of computing devices in the rack.Lid 510 may define an empty chamber space located between lower portion516 (where lid 510 and the wedge racks connect) and upper portion 520 oflid 510. The empty space may be house wiring and a top-of-rack networkswitch in some embodiments. In some cases, chamber 500 may include aleveling base 512 described with reference to FIGS. 11-13.

In some cases, the number of wedge racks 505 is at least three racks,e.g., five racks or six racks, or more. In some embodiments, each wedgerack 505 may be substantially identical to the other wedge racks, andeach receptacle, called a “U” in each rack may be substantiallyidentical to the others. In some embodiments, when assembled, theorientation of the wedge racks may differ by an amount less than 180degrees, e.g., less than 90 degrees. In some embodiments, as describedbelow, each wedge rack may be engineered with a holistic embeddedsystems engineering methodology to allow the rack to function as a“device”/“appliance”, and not as a traditional rack/row architecture,which is expected to be particularly advantageous in web-scaleapplications. In some embodiments, chamber 500 may eliminate traditional“U's” of measurement by integrating the “pitch” into the chamber itself.That said, embodiments are not limited to systems that provide thesebenefits, as various independently useful techniques are described here,which is not to suggest that any other feature may not be omitted insome cases.

In some cases, the datacenter chamber 500 may house more than 50 U's ofcomputing devices 514 and may span more than 5 feet in diameter (e.g.,approximately 9 feet). Further, in some cases, the racks in the chambermay be approximately the height of a person, e.g., on the order of sixfeet tall to facilitate access by technicians (e.g., five feet orhigher). In some embodiments, one or more datacenter chambers may bepart of a modular data center that can be placed where data capacity isneeded. This may allow for rapid deployment, energy efficiency,high-density computing, and cost reduction (though embodiments are alsoconsistent with a non-modular design).

In some embodiments, a plurality of datacenter chamber 500 may be may bearranged in a datacenter. FIG. 2 illustrates an example of a datacenterhaving an array of cylindrical datacenter chambers. In some embodiments,the chambers may be arranged in a square or a hexagonal lattice, orother arrangements. In some cases, one or more datacenter chambers 500may be added to existing data centers with or without similarcharacteristics (e.g., having different server rack units). In someembodiments, one or more datacenter chambers 500 may be containerizedfor easy transportation. For example, datacenter chambers 500 (with orwithout datacenter equipment) may be configured to fit into a standardshipping container, which is then transported to a desired location.Datacenter chamber 500 may be advantageous for use in portable datacenter environments at least because it of its integrated cooling orventilation system capacity as will be discussed below.

Controlling air temperature and humidity in the chamber (and in adatacenter in general) is expected to help protect equipment frommalfunction and damage. In some cases it may also reduce powerconsumption and cost. For example, temperatures in a datacenter chamber500 may rise because of the amount of power used in the datacenterchamber which may cause heat damage to equipment on the wedge racks.High humidity may cause water to condense on internal components withinthe datacenter chamber. Low humidity may cause static electricitydischarge problems which may damage components within the datacenterchamber. A variety of arrangements may direct air to flowcircumferentially inward or outward to cool rack-mounted computingequipment. In the illustrated embodiment, wedge racks 505 of chamber 500(FIG. 1) are arranged into a cylindrical shape (or they may be arrangedin other shapes described above such as a square, hexagon, or octagonwith the back sides all facing towards the center). This, in some cases,allows outside cold air to be pulled (or pushed) in from several (e.g.,all horizontal) directions to cool equipment in chamber 500. The cold(e.g., relative to the computing equipment) air may flow over thecomputing devices, drawing heat therefrom, and into the interiorcylinder. From the cylinder, the air may be exhausted through a fan thatdrives the airflow as shown by the arrows in FIG. 3.

The incoming air is heated as it passes across heatsinks (pulling wasteheat from computing equipment) and other warm components inside theequipment, in these embodiments. In some embodiments, the hot air exitsthe backs of the wedge racks and enters the inner chamber and exitsthrough the top of the chamber. FIGS. 3-4 illustrate operation of thechamber of FIG. 1, in accordance with some embodiments. Cold air may bepulled or pushed from all directions of chamber 500, drawn to the innerchamber and exits through an exhaust output 522 in the top of chamber500. (Or the flow may be reversed.) In some embodiments, a lid (e.g.,lid 510 of FIG. 10) configured to cover the top of the chamber serves asa barrier that prevents the hot air from mixing back in with the coldair. In some embodiments, a fan 524 in FIGS. 3-4, or an array of fansmay be arranged and positioned in the top of the lid and configured topull the hot air upward. In some cases, the fan may be configured topull the hot air into ductwork that routes the air elsewhere.

In some embodiments, chamber 500 may include dampers configured toadjust the flow of air. FIG. 5 illustrates an example of dampers 525. Insome cases, dampers 525 in FIGS. 3 and 5, located at the base of thechamber may be used to adjust the flow of air. In some embodiments, thedampers may include one or more valves, or plates configured to control,stop, or regulate the flow of air inside chamber 500. In someembodiments, one or more dampers may be manual (e.g., using a manualhandle to control the damper), or automatic (e.g., using motors that arecontrolled by a thermostat). Industry recommended temperatures generallyrange between 64 and 81° F., a dew point range between 41 and 59° F.,and a maximum relative humidity of 60. In some embodiments, temperaturesmay range between 59 and 90° F.

In some embodiments, chamber 500 may include an integrated coolingsystem configured for directing air to flow circumferentially inward oroutward to cool rack-mounted computing equipment, for instance, bydriving a cooling fluid along computing devices mounted in the wedgeracks of chamber 500 and through the interior chamber of chamber 500.The present techniques are described with reference to a cooling gas(air), but are consistent with other fluids, e.g., in systems immersedin mineral oil. In some embodiments, the integrated cooling system ofchamber 500 is independent from other cooling systems (e.g., for otherchambers in the datacenter, for the room where the datacenter islocated, or for the building where the datacenter is located). In somecases, the integrated cooling system of chamber 500 may be controlled inconcert with other cooling systems for other chambers, for the room orfor the building. Cooling systems, humidifiers, ventilators, or othertemperature and humidity control systems may be used to help control airtemperature and humidity. In some embodiments, the integrated coolingsystem of chamber 500 may be configured to provide cooling and humiditycontrol by directly drawing fresh air into the cooling system (e.g.,through a vent, duct, etc.) In some embodiments, the integrated coolingsystem may be a portable cooling system. In other cases, the integratedcooling system maybe an integral part of chamber 500 (e.g., part of thechassis described below).

The integrated cooling system of chamber 500 may use one or moredifferent techniques for forcing air to flow over computing equipmentmounted in the wedge-shaped racks. For example, the cooling system maydrive a cooling fluid (e.g., air, gas, water, chemicals, or othercooling fluids) along equipment in chamber 500 and through the interiorchamber with a pump, like a centrifugal pump, in the case of liquids, ora fan, in the case of gasses. The cool fluid is heated as it passesthrough equipment and is driven out of the chamber. For example in caseof air or other gasses, the heated fluid may be driven out by a fanlocated near an end of the interior chamber e.g., top (or locatedelsewhere within, or near to chamber 500) to a duct or a vent. Or in thecase of cooling liquids, the heated liquid may be directed out of thechamber and into a heat exchanger using a pump.

For instance, in some embodiments, chamber 500 may include an integratedventilation infrastructure. In some embodiments, the integratedventilation infrastructure of chamber 500 is independent of otherventilation systems of other chambers, room, or building. In some cases,the integrated ventilation infrastructure may be controlled in concertwith ventilation of other chambers in the datacenter, ventilation of theroom, or building. In some embodiments, the ventilation infrastructuremay include one or more fans in series or parallel. In some embodiments,the integrated ventilation infrastructure includes a plurality of motorsattached to a fan through controlled clutches.

FIG. 6 illustrates a chassis of the datacenter chamber 500 of FIG. 1, inaccordance with some embodiments. Chassis 526 may be configured tosecure one or more racks in spaced relation relative to one another.Chassis 526 may be configured to position the racks facing at leastthree different directions, e.g., six directions in the illustratedexample. Wedge rack 536 (FIG. 7) is secured to chassis 526 such thatchamber 536 is facing outward from the interior chamber defined by theback side of chamber 536 and the back side of other racks when securedto chassis 526. This may eliminate the need to reach the back side ofthe chamber (for maintenance, computing, networking, etc.), as opposedto existing rack cabinets which necessitate access to the back of therack cabinets for operating some functions of the equipment, servicing,or securing the equipment. Existing rack cabinets are usually placed insingle rows forming aisles between them to allow access to the back ofthe rack cabinets.

In some embodiments, chassis 526 includes a chamber brace 532 configuredto connect to a leveling base 528 of chassis 526. Brace 532 is amulti-surface brace. Each surface is configured to receive a wedge rack.In some embodiments, brace 532 may be configured to fit within levelingbase 528. In some cases brace 532 may be configured to fit on top ofleveling base 528. In some embodiments, brace 532 and leveling base 528may be configured to be removably connected (screws for example). Insome embodiments, brace 532 and leveling base 528 may be permanentlyconnected (e.g., welded, or permanently glued together).

In some embodiments, chassis 526 may include baffles 530/534 configuredfor directing air for an efficient air flow within chamber 500 (e.g.,for cooling, ventilation, heat exchange, etc.) In some cases, thebaffles may make airflow more uniform into or out of the chamber.Different rack-mounted computing devices may obstruct air differently,potentially leading to areas of high flow and other areas of low flow.The low flow areas may not be adequately cooled. To mitigate this issue,the baffles may constrain airflow and, thereby, account for asubstantial portion of the pressure drop between the interior andexterior of the chamber. As a result, it is expected thatcomputing-device specific differences in the pressure drop will accountfor a smaller portion of the total pressure drop, thereby evening fluidflow. In some embodiments, the baffles may be in the form of vanes,panels, orifices, or other forms. In some embodiments, the baffles maybe one or more of longitudinal, horizontal, or other type of baffles.

In some embodiments, baffles 530/534 may include baffles configured tovary airflow restriction vertically along the length of the interiorchamber to reduce the likelihood of positive pressure developing in thedownstream end of the interior chamber. Positive pressure on what isintended to be the downstream side of the rack, in some use cases, isundesirable, as it can cause hot air to flow back from the interiorchamber towards some of the racks, heating rather than cooling computingequipment. For instance, from the bottom of the interior chamber to thetop of the interior chamber, the amount of airflow restriction providedmay progressively increase, e.g., from an unobstructed region along onequarter of the length, to a partially obstructed region spanning thenext quarter of the length, to an even more obstructed region spanningthe next quarter of the length, and finally to a fully obstructedportion for the final quarter. A variety of structures may be used topartially obstruct airflow. Examples include arrays of holes drilled ina plate (like in a hexagonal lattice), with hole size and densitydecreasing as airflow obstruction increases. In some embodiments,airflow restriction may vary smoothly from one end of the chamber to theother, or separate portions may be defined. In some embodiments a filtermedia of increasing density may vary the resistance to airflow. In someembodiments the varying impediments to flow may be placed at the outerradius of the chamber or intermediate between the inner chamber andouter surface.

FIG. 7 illustrates an example of a wedge rack 536 positioned on chassis526. In this example, wedge rack 536 defines a generally wedge-shapedvolume 541 along at least one side of the wedge rack. In someembodiments, the wedge rack comprises three articulating panels. A firstpanel 539 (not shown, but the element number identifies the area coveredby the panel) may be configured to selectively provide access to a rackof computing devices 544, a second panel 540 configured to selectivelyprovide access to a first wedge-shaped volume on one side of the rack ofcomputing devices 544, and a third panel 543 configured to selectivelyprovide access to a second wedge-shaped volume on a second side of therack of computing devices. In some embodiments, computing devices may bedisposed on equipment selves 546. First panel 539 may provide front-sideaccess (front side being the opposite side of a back side adjacent tothe interior chamber) for compute, network, and storage interfaces forcomputing devices mounted in the racks. Wedge rack 536 may include wedgerack top cover 542 configured to fit on top of wedge 536. In someembodiments, top cover 542 may be removably connected to the top ofwedge 536. In some cases, wedge 536 may be permanently connected to thetop of wedge 536.

FIGS. 8-10 illustrate examples of components of a wedge rack, inaccordance with some embodiments. In some embodiments, wedge rack 536includes a plurality of structural support elements configured toprovide structural support and allow for heavy equipment mounting. Forexample, FIG. 8 shows rack front supports 550 located proximate an outerface of the wedge rack and extending vertically, rack rear support 552located proximate to a back side of the wedge rack and extendingvertically, and bus bar braces 556 extending horizontally and locatedproximate to a back side of the wedge rack adjacent the interior chambercoupled approximately perpendicular to rack rear support 552 and rackfront support 550. A plurality of bus bars 554 may be disposed along theracks adjacent the interior chamber. Bus bar 556 may be connected to busbraces 556 (e.g., via screws).

The bus bars may be configured to distribute direct current (DC) powerto at least some of the computing equipment by conducting electricity(e.g., direct current) within the racks, e.g., delivering power to rackmounted computing devices that establish electrical contact with the busbars upon being slid into the rack. The bus bars may be in the form of ametallic strip or bar (e.g., copper, brass or aluminum), and the busbars may be electrically isolated from the chamber chassis. In someembodiments, the bus bars may be of other shapes (e.g., flat strips,solid bars and rods, solid or hollow tubes, and braided wire). Some ofthese shapes allow heat to dissipate more efficiently due to their highsurface area to cross-sectional area ratio. Hollow or flat shapes areprevalent in higher current applications. In some cases, the one or morebus bars may be enclosed in a bus duct. The material composition andcross-sectional size of the bus bar may determine the maximum amount ofcurrent that can be safely carried. In some embodiments, the bus barsmay have insulators 564, or insulation may surround them in some casesto protect them from accidental contact. In some cases bus bars may beenclosed in a metal housing, in the form of bus duct or busway,segregated-phase bus, or isolated-phase bus.

In some embodiments, chamber 500 may include a plurality of directcurrent (DC) bus bars for power distribution. Generally, rack-mountedcomputing equipment consumes DC power. Traditionally, in many cases eachinstance of equipment received alternative current (AC) power andconverted the AC power to DC power with a dedicated power converter.This technique however can be expensive and generate additional heatnear the computing equipment. Some embodiment may eliminate the need forthe AC power converters by providing DC power. Or in some cases it canbe expensive to power an AC voltage input power supply from the DC busbar. In some embodiments, a bus bar power adapter may allow traditionalAC voltage servers to be safely powered, and in some cases, controlledor monitored, via a DC power source.

In some embodiments, datacenter chamber 500 may include a backup powersupply. In some cases, chamber 500 may include an integrated powerinfrastructure. For example, an uninterruptable power supply (UPS) whichmay be configured to provide uninterrupted power over some duration. Insome embodiments, the power supply may be a battery-driven power supply(As shown in FIGS. 9-10 wedge rack 536 may include a rectifier or abattery module 558). For example, a higher-voltage direct current (DC)power source, such as a battery may provide electrical power that isconverted into a lower voltage, higher current DC power source. In someembodiments, the battery may be based on any of a variety of differentchemistries. Examples include lead-acid, nickel-metal hydride, lithiumion, and the like. In some embodiments, other power sources may be used,such as fuel cells, banks of capacitors, and the like. Thetransformation may be effected by a DC-DC converter, such as a 48-voltto 12-volt DC-DC converter that receives 48 volt DC power at givencurrent and produces 12-volt DC power at a substantially higher current.In some embodiments, the several of the above UPSs may be placed in eachrack. In some embodiments, each wedge of a rack may include a separateUPS, e.g., three or more UPSs for each wedge connected in parallel toincrease current at a given voltage over that provided by a single UPS.Modular power supplies are expected to limit the scope of damage if anyone UPS fails. In some embodiments, the UPS may be controlled remotely.

In some embodiments, datacenter chamber 500 includes a plurality ofcomputing devices disposed in the racks. The computing devices may bedisposed on equipment trays 560. In some cases trays 560 may have aplurality of openings on the back of the trays adjacent the innerchamber. The opening may be configured to facilitate connection of theequipment and bus bars. In some embodiments, the openings may includebus bar connectors (example 562 in FIG. 9). The computing devices mayhave stored thereon operating systems and user-applications (e.g.,server applications, databases, load balancers, etc.)

In some embodiments, datacenter chamber 500 may include an integratedcompute fabric configured to connect a plurality of computing deviceswithin the chamber. The integrated compute fabric may be configured toconnect the computing devices through interconnected nodes and linksthat look like a “fabric”. The nodes may refer to processors, memory, orperipherals and the links may refer to functional connection betweennodes. The integrated compute fabric may allow for high processingcapabilities.

With some traditional systems, installations are difficult when racksare required to be positioned in relatively precise orientations inorder to create a particular geometric shape or to direct airflow. Tomitigate this issue, some embodiments use a modular and interlockingleveling base 570 (FIGS. 11-13) framework that serves to both level andto orient the racks into alignment, thus enabling the assembly ofcomplex arrangements of racks with ease. That said, embodiments are notlimited to systems that provide these benefits, as various independentlyuseful techniques are described here, which is not to suggest that anyother feature may not be omitted in some cases.

In some embodiments, leveling base 570 includes a center piece 572 and aplurality of horizontally extending arms 574. Center piece 572 may be ofhexagonal shape. Or in other cases, the leveling base may of triangular,square, pentagonal, hexagonal, heptagonal, octagonal, decagonal,dodecagonal, or other shapes. In some embodiments the leveling base isof the same shape as the base of chassis (described above). In someembodiments, the leveling base includes a plurality of modular sectionsconfigured to be connected together to form the leveling base (e.g.,screws, rivets, etc.) This may help in shipping, installation andconfiguration of the leveling base. In some embodiments, the modularsections may be assembled on-site and then leveled to ensure even weightdistribution across the floor. In some embodiments, leveling base 570may be constructed of aluminum, steel, or a combination thereof to helpkeep the weight down. The leveling base may be bolted to the floor,using a plurality of bolting plates 578 (as shown in FIG. 12) located inthe bottom side of the leveling base, to secure the structure in placeto allow for installation and alignment of the racks. The bolting platesmay be arranged such that they extend away from the leveling basetowards the inner center section of the base.

In some embodiments, the bottom side of the leveling base includes aplurality of adjustable leveling feet 576 configured to level the baseand, later when installed, the rest of the chamber. The adjustableleveling feet may be configured to be threaded in the leveling base toallow for adjusting the height of the leveling base and locking for thelevel of the base. Or other height-adjustable implements may be used,e.g., shims, wedges, hydraulic feet, ratchets, or interchangeable feetof different sizes. In some embodiments, each extending arm may includeat least one adjustable leveling foot. In some cases, the leveling basemay include a plurality of height-adjustable feet extending from thebottom of the base. In some cases, the height adjustable stands may bebolts threaded into a threaded interface of the base. The bolts extenddownward to feet 576, the bolts being adjustable thereby adjusting theheight of the feet. In some cases, before the racks are installed, thebase may be leveled, so that the weight of the chamber does notinterfere with leveling.

In some embodiments, as shown in FIG. 13, the upper side of the levelingbase includes devices for reducing friction as a wedge-shaped rack istranslated over the base. In this example, a plurality of ball bearings580 located in the extending arms 574 and the center piece 572 of theleveling base 570. The ball bearings are configured to create a guideand support for the racks as they are lifted slightly and slide intoplace. In some embodiments, the ball bearings 580 include a steel ballseated in a socket. A portion of the ball may extend out of the socketand above the base, with the socket extending into the respective arm,so that less than half of the ball bearing extends above the top surfaceof the arm. In some cases, each ball bearing has a diameter of betweenone and three centimeters. In some embodiment, the socket may house aplurality of smaller bearings (e.g., between 2 and 5 millimeters) onwhich the exposed ball bearing rides to lower friction. Examples includean SP-30 ball transfer unit available from Ahcell of Taizhou, JiangsuProvince in China. In some embodiments, each extending arm may includeeight ball bearings configured such that four ball bearings guide andsupport one bottom side of a rack and the other four ball bearings onthe same arm are configured to guide and support one bottom side of anadjacent rack.

During installation of a wedge-rack, the wedge-rack may be translated(e.g., slid, rolled or carried) horizontally toward the interiorchamber, between the respective arms receiving the unit. As the rackmakes contact with the distal portion of the ball bearings extendingupward from the arms, the bottom of the rack 582 may be lifted (in somecases by being slid against and up onto the ball bearings) and rolled ontop of the ball bearing located on the arms located on each side of thebottom of the rack. Once on the ball bearing the bottom of the rack ispushed (with relatively little effort) such that the back side 584 ofthe bottom of the rack is on top of the ball bearing located on thecenter piece of the leveling base. As the rack is pushed backward afirst force is generated translating the rack slightly upward, as therack rolls onto the ball bearings. Then, as the rack rolls over the ballbearings, the rack may translate downward to sit on the leveling base,e.g., the bottom of the rack may include an indent to receive each ballbearings when in the proper position, thereby providing haptic feedbackindicative of proper alignment.

Once in place, the bottom of the rack may be secured using an electroniclatch, or a manual latch (e.g., a peg in a hole). In some embodiments,once the rack is in place a signal indicating that the rack is properlyseated on the leveling arm may be generated (e.g., audible signal,visual signal, or other forms of signals). In some embodiments, a gasketsealer may be used to seal the racks side by side and to seal the backside of the rack to the chassis.

Alternatively or additionally, the leveling base may include air-castersconfigured to secure each of the racks to the leveling base. In someembodiments, air-casters may be created in the assembled leveling basesuch that they coincide with mating structures on the bottom side of therack. The air-casters create a guide for the racks as they are liftedslightly and slid into place. Once in position, the rack is lowered ontothe base and settles into the air-casters, which is expected to helpwith proper alignment. In some embodiments, other structures may reducefriction, e.g., Teflon™ bushings, bearings on the bottom of the rack,wheels on the top of the base or bottom of the rack, etc.

FIG. 14 is a diagram that illustrates an exemplary computing system 1000in accordance with embodiments of the present technique. In some cases,each U in each rack of the above-described chamber may house one or moreof these systems 1000. Various portions of systems and methods describedherein, may include or be executed on one or more computer systemssimilar to computing system 1000. Further, processes and modulesdescribed herein may be executed by one or more processing systemssimilar to that of computing system 1000.

Computing system 1000 may include one or more processors (e.g.,processors 1010 a-1010 n) coupled to system memory 1020, an input/outputI/O device interface 1030, and a network interface 1040 via aninput/output (I/O) interface 1050. A processor may include a singleprocessor or a plurality of processors (e.g., distributed processors). Aprocessor may be any suitable processor capable of executing orotherwise performing instructions. A processor may include a centralprocessing unit (CPU) that carries out program instructions to performthe arithmetical, logical, and input/output operations of computingsystem 1000. A processor may execute code (e.g., processor firmware, aprotocol stack, a database management system, an operating system, or acombination thereof) that creates an execution environment for programinstructions. A processor may include a programmable processor. Aprocessor may include general or special purpose microprocessors. Aprocessor may receive instructions and data from a memory (e.g., systemmemory 1020). Computing system 1000 may be a uni-processor systemincluding one processor (e.g., processor 1010 a), or a multi-processorsystem including any number of suitable processors (e.g., 1010 a-1010n). Multiple processors may be employed to provide for parallel orsequential execution of one or more portions of the techniques describedherein. Processes, such as logic flows, described herein may beperformed by one or more programmable processors executing one or morecomputer programs to perform functions by operating on input data andgenerating corresponding output. Processes described herein may beperformed by, and apparatus can also be implemented as, special purposelogic circuitry, e.g., an FPGA (field programmable gate array) or anASIC (application specific integrated circuit). Computing system 1000may include a plurality of computing devices (e.g., distributed computersystems) to implement various processing functions.

I/O device interface 1030 may provide an interface for connection of oneor more I/O devices 1060 to computer system 1000. I/O devices mayinclude devices that receive input (e.g., from a user) or outputinformation (e.g., to a user). I/O devices 1060 may include, forexample, graphical user interface presented on displays (e.g., a cathoderay tube (CRT) or liquid crystal display (LCD) monitor), pointingdevices (e.g., a computer mouse or trackball), keyboards, keypads,touchpads, scanning devices, voice recognition devices, gesturerecognition devices, printers, audio speakers, microphones, cameras, orthe like. I/O devices 1060 may be connected to computer system 1000through a wired or wireless connection. I/O devices 1060 may beconnected to computer system 1000 from a remote location. I/O devices1060 located on remote computer system, for example, may be connected tocomputer system 1000 via a network and network interface 1040.

Network interface 1040 may include a network adapter that provides forconnection of computer system 1000 to a network. Network interface may1040 may facilitate data exchange between computer system 1000 and otherdevices connected to the network. Network interface 1040 may supportwired or wireless communication. The network may include an electroniccommunication network, such as the Internet, a local area network (LAN),a wide area network (WAN), a cellular communications network, or thelike.

System memory 1020 may be configured to store program instructions 1100or data 1110. Program instructions 1100 may be executable by a processor(e.g., one or more of processors 1010 a-1010 n) to implement one or moreembodiments of the present techniques. Instructions 1100 may includemodules of computer program instructions for implementing one or moretechniques described herein with regard to various processing modules.Program instructions may include a computer program (which in certainforms is known as a program, software, software application, script, orcode). A computer program may be written in a programming language,including compiled or interpreted languages, or declarative orprocedural languages. A computer program may include a unit suitable foruse in a computing environment, including as a stand-alone program, amodule, a component, or a subroutine. A computer program may or may notcorrespond to a file in a file system. A program may be stored in aportion of a file that holds other programs or data (e.g., one or morescripts stored in a markup language document), in a single filededicated to the program in question, or in multiple coordinated files(e.g., files that store one or more modules, sub programs, or portionsof code). A computer program may be deployed to be executed on one ormore computer processors located locally at one site or distributedacross multiple remote sites and interconnected by a communicationnetwork.

System memory 1020 may include a tangible program carrier having programinstructions stored thereon. A tangible program carrier may include anon-transitory computer readable storage medium. A non-transitorycomputer readable storage medium may include a machine readable storagedevice, a machine readable storage substrate, a memory device, or anycombination thereof. Non-transitory computer readable storage medium mayinclude non-volatile memory (e.g., flash memory, ROM, PROM, EPROM,EEPROM memory), volatile memory (e.g., random access memory (RAM),static random access memory (SRAM), synchronous dynamic RAM (SDRAM)),bulk storage memory (e.g., CD-ROM or DVD-ROM, hard-drives), or the like.System memory 1020 may include a non-transitory computer readablestorage medium that may have program instructions stored thereon thatare executable by a computer processor (e.g., one or more of processors1010 a-1010 n) to cause the subject matter and the functional operationsdescribed herein. A memory (e.g., system memory 1020) may include asingle memory device or a plurality of memory devices (e.g., distributedmemory devices).

I/O interface 1050 may be configured to coordinate I/O traffic betweenprocessors 1010 a-1010 n, system memory 1020, network interface 1040,I/O devices 1060, or other peripheral devices. I/O interface 1050 mayperform protocol, timing, or other data transformations to convert datasignals from one component (e.g., system memory 1020) into a formatsuitable for use by another component (e.g., processors 1010 a-1010 n).I/O interface 1050 may include support for devices attached throughvarious types of peripheral buses, such as a variant of the PeripheralComponent Interconnect (PCI) bus standard or the Universal Serial Bus(USB) standard.

Embodiments of the techniques described herein may be implemented usinga single instance of computer system 1000 or multiple computer systems1000 configured to host different portions or instances of embodiments.Multiple computer systems 1000 may provide for parallel or sequentialprocessing/execution of one or more portions of the techniques describedherein.

Those skilled in the art will appreciate that computer system 1000 ismerely illustrative and is not intended to limit the scope of thetechniques described herein. Computer system 1000 may include anycombination of devices or software that may perform or otherwise providefor the performance of the techniques described herein. For example,computer system 1000 may include or be a combination of acloud-computing system, a data center, a server rack, a server, avirtual server, a desktop computer, a laptop computer, a tabletcomputer, a server device, a client device, a mobile telephone, apersonal digital assistant (PDA), a mobile audio or video player, a gameconsole, a vehicle-mounted computer, or a Global Positioning System(GPS), or the like. Computer system 1000 may also be connected to otherdevices that are not illustrated, or may operate as a stand-alonesystem. In addition, the functionality provided by the illustratedcomponents may in some embodiments be combined in fewer components ordistributed in additional components. Similarly, in some embodiments,the functionality of some of the illustrated components may not beprovided or other additional functionality may be available.

Those skilled in the art will also appreciate that while various itemsare illustrated as being stored in memory or on storage while beingused, these items or portions of them may be transferred between memoryand other storage devices for purposes of memory management and dataintegrity. Alternatively, in other embodiments some or all of thesoftware components may execute in memory on another device andcommunicate with the illustrated computer system via inter-computercommunication. Some or all of the system components or data structuresmay also be stored (e.g., as instructions or structured data) on acomputer-accessible medium or a portable article to be read by anappropriate drive, various examples of which are described above. Insome embodiments, instructions stored on a computer-accessible mediumseparate from computer system 1000 may be transmitted to computer system1000 via transmission media or signals such as electrical,electromagnetic, or digital signals, conveyed via a communication mediumsuch as a network or a wireless link. Various embodiments may furtherinclude receiving, sending, or storing instructions or data implementedin accordance with the foregoing description upon a computer-accessiblemedium. Accordingly, the present invention may be practiced with othercomputer system configurations.

The reader should appreciate that the present application describesseveral inventions. Rather than separating those inventions intomultiple isolated patent applications, applicants have grouped theseinventions into a single document because their related subject matterlends itself to economies in the application process. But the distinctadvantages and aspects of such inventions should not be conflated. Insome cases, embodiments address all of the deficiencies noted herein,but it should be understood that the inventions are independentlyuseful, and some embodiments address only a subset of such problems oroffer other, unmentioned benefits that will be apparent to those ofskill in the art reviewing the present disclosure. Due to costsconstraints, some inventions disclosed herein may not be presentlyclaimed and may be claimed in later filings, such as continuationapplications or by amending the present claims. Similarly, due to spaceconstraints, neither the Abstract nor the Summary of the Inventionsections of the present document should be taken as containing acomprehensive listing of all such inventions or all aspects of suchinventions.

It should be understood that the description and the drawings are notintended to limit the invention to the particular form disclosed, but tothe contrary, the intention is to cover all modifications, equivalents,and alternatives falling within the spirit and scope of the presentinvention as defined by the appended claims. Further modifications andalternative embodiments of various aspects of the invention will beapparent to those skilled in the art in view of this description.Accordingly, this description and the drawings are to be construed asillustrative only and are for the purpose of teaching those skilled inthe art the general manner of carrying out the invention. It is to beunderstood that the forms of the invention shown and described hereinare to be taken as examples of embodiments. Elements and materials maybe substituted for those illustrated and described herein, parts andprocesses may be reversed or omitted, and certain features of theinvention may be utilized independently, all as would be apparent to oneskilled in the art after having the benefit of this description of theinvention. Changes may be made in the elements described herein withoutdeparting from the spirit and scope of the invention as described in thefollowing claims. Headings used herein are for organizational purposesonly and are not meant to be used to limit the scope of the description.

As used throughout this application, the word “may” is used in apermissive sense (i.e., meaning having the potential to), rather thanthe mandatory sense (i.e., meaning must). The words “include”,“including”, and “includes” and the like mean including, but not limitedto. As used throughout this application, the singular forms “a,” “an,”and “the” include plural referents unless the content explicitlyindicates otherwise. Thus, for example, reference to “an element” or “aelement” includes a combination of two or more elements, notwithstandinguse of other terms and phrases for one or more elements, such as “one ormore.” The term “or” is, unless indicated otherwise, non-exclusive,i.e., encompassing both “and” and “or.” Terms describing conditionalrelationships, e.g., “in response to X, Y,” “upon X, Y,”, “if X, Y,”“when X, Y,” and the like, encompass causal relationships in which theantecedent is a necessary causal condition, the antecedent is asufficient causal condition, or the antecedent is a contributory causalcondition of the consequent, e.g., “state X occurs upon condition Yobtaining” is generic to “X occurs solely upon Y” and “X occurs upon Yand Z.” Such conditional relationships are not limited to consequencesthat instantly follow the antecedent obtaining, as some consequences maybe delayed, and in conditional statements, antecedents are connected totheir consequents, e.g., the antecedent is relevant to the likelihood ofthe consequent occurring. Statements in which a plurality of attributesor functions are mapped to a plurality of objects (e.g., one or moreprocessors performing steps A, B, C, and D) encompasses both all suchattributes or functions being mapped to all such objects and subsets ofthe attributes or functions being mapped to subsets of the attributes orfunctions (e.g., both all processors each performing steps A-D, and acase in which processor 1 performs step A, processor 2 performs step Band part of step C, and processor 3 performs part of step C and step D),unless otherwise indicated. Further, unless otherwise indicated,statements that one value or action is “based on” another condition orvalue encompass both instances in which the condition or value is thesole factor and instances in which the condition or value is one factoramong a plurality of factors. Unless specifically stated otherwise, asapparent from the discussion, it is appreciated that throughout thisspecification discussions utilizing terms such as “processing,”“computing,” “calculating,” “determining” or the like refer to actionsor processes of a specific apparatus, such as a special purpose computeror a similar special purpose electronic processing/computing device.

The present techniques will be better understood with reference to thefollowing enumerated embodiments:

-   1. A datacenter chamber having racks configured to hold arrays of    rack-mounted computing devices, the datacenter chamber comprising:    three or more racks, each rack having a plurality of receptacles    configured to hold a computing device; a chassis configured to    secure each of the racks in spaced relation relative to one another,    wherein the chassis is configured to secure the racks facing outward    from an interior chamber defined by a back-side of the racks, and    wherein the chassis is configured to position the racks facing at    least three different directions; and an integrated cooling system    configured to drive a cooling fluid along computing devices mounted    in the racks and through the interior chamber.-   2. The datacenter chamber of embodiment 1, wherein the integrated    cooling system comprises a fan mounted in fluid communication with    the interior chamber.-   3. The datacenter chamber of any of embodiments 1-2, wherein the    interior chamber defines an approximately hexagonal cylindrical    shape and the integrated cooling system comprises a fan.-   4. The datacenter chamber of any of embodiments 1-3, further    comprising an exhaust vent configured to mount to an end of the    interior chamber.-   5. The datacenter chamber of any of embodiments 1-4, further    comprising an integrated power infrastructure.-   6. The datacenter chamber of any of embodiments 1-5, further    comprising a plurality of direct current (DC) power bars extending    generally parallel to the interior chamber and positioned to    electrically couple to computing devices inserted into the    receptacles during and as a result of insertion.-   7. The datacenter chamber of any of embodiments 1-6, further    comprising an integrated ventilation infrastructure.-   8. The datacenter chamber of any of embodiments 1-7, further    comprising an integrated compute fabric configured to connect the    computing devices.-   9. The datacenter chamber of any of embodiments 1-8, wherein at    least some of the racks comprise front-side access, opposite the    interior chamber, for compute, network, and storage interfaces for    computing devices mounted in the racks.-   10. The datacenter chamber of any of embodiments 1-9, further    comprising: a tube defined by surrounding baffles, at least    partially defining the interior chamber, and sized such that sides    of the tube correspond to at least one of the racks.-   11. The datacenter chamber of any of embodiments 1-10, wherein the    chassis comprises bearings configured to at least partially support    and rotate against at least one of the racks during installation of    the respective rack.-   12. The datacenter chamber of any of embodiments 1-11, wherein at    least one of the racks is a wedge rack defining generally    wedge-shaped volume along at least one side of the rack and    configured to hold more than four computing devices.-   13. The datacenter chamber of embodiment 12, wherein the wedge rack    comprises: a first articulating panel configured to selectively    provide access to a rack of computing devices: a second articulating    panel configured to selectively provide access to a first    wedge-shaped volume on one side of the rack of computing devices;    and a third articulating panel configured to selectively provide    access to a second wedge-shaped volume on a second side of the rack    of computing devices.-   14. The datacenter chamber of embodiment 13, comprising a plurality    of rectifier modules disposed in the first wedge-shaped volume.-   15. The datacenter chamber of any of embodiments 1-14, further    comprising: a plurality of bus bars disposed along the racks    adjacent the interior chamber; and a plurality of bus-bar braces    coupled approximately perpendicular to the bus bars.-   16. The datacenter chamber of any of embodiments 1-15, further    comprising: a plurality of computing devices disposed in the racks,    the computing devices having stored thereon operating systems and    applications executing within the operating systems.-   17. The datacenter chamber of any of embodiments 1-16, wherein the    chassis comprises means for directing air to flow circumferentially    inward or outward to cool rack-mounted computing equipment.-   18. The datacenter chamber of any of embodiments 1-17, comprising:    five or more wedge-shaped racks, each wedge-shaped rack being    substantially identical to the other wedge-shaped racks, the five or    more wedge shaped racks defining a cylinder having a base with five    or more sides corresponding to the interior volume, and the five or    more wedge shaped racks extending more than five feet along the    length of the interior chamber, wherein: the chassis comprises a    base comprising: means for leveling the base; means for reducing    friction as a wedge-shaped rack is translated over the base; the    integrated cooling system comprises means for forcing air to flow    over computing equipment mounted in the wedge-shaped racks; and the    chassis comprises means for distributing direct current (DC) power    to at least some of the computing equipment.-   19. A base for a server rack, the base comprising: a first arm    extending in a first direction; a second arm extending in a second    direction, different from the first direction, the first arm and    second arm each having a bottom configured to face a floor and a top    configured to face toward rack-mounted computing equipment; a    plurality of height-adjustable stands extending from the bottom of    the first arm and the second arm; and a plurality of ball-bearings    extending from the top of the first arm and the second arm.-   20. The base of embodiment 19, wherein the ball bearings are each    seated in a respective socket having a plurality of smaller ball    bearings.-   21. The base of any of embodiments 19-20, wherein the height    adjustable stands are bolts threaded into a threaded interface of    the first or the second arm.

What is claimed is:
 1. A datacenter chamber having racks configured tohold arrays of rack-mounted computing devices, the datacenter chambercomprising: three or more racks, each rack having a plurality ofreceptacles configured to hold a computing device; a chassis configuredto secure each of the racks in spaced relation relative to one another,wherein the chassis is configured to secure the racks facing outwardfrom an interior chamber defined by a back-side of the racks, andwherein the chassis is configured to position the racks facing at leastthree different directions; an integrated cooling system configured todrive a cooling fluid along the computing devices mounted in the racksand through the interior chamber; and wherein the chassis furthercomprises a tube defined by surrounding air-flow restrictors, at leastpartially defining the interior chamber, and sized such that sides ofthe tube correspond to at least three of the racks, wherein an amount ofairflow restriction afforded by the airflow restrictors increases alongat least half the length of the interior chamber.
 2. The datacenterchamber of claim 1, wherein the integrated cooling system comprises afan mounted in fluid communication with the interior chamber.
 3. Thedatacenter chamber of claim 1, wherein the interior chamber defines ahexagonal cylindrical shape and the integrated cooling system comprisesa fan.
 4. The datacenter chamber of claim 1, further comprising anexhaust vent configured to mount to an end of the interior chamber. 5.The datacenter chamber of claim 1, further comprising an integratedpower infrastructure.
 6. The datacenter chamber of claim 1, furthercomprising a plurality of direct current (DC) power bars extendinggenerally parallel to the interior chamber and positioned toelectrically couple to the computing devices inserted into thereceptacles during and as a result of insertion.
 7. The datacenterchamber of claim 1, further comprising an integrated ventilationinfrastructure.
 8. The datacenter chamber of claim 1, further comprisingan integrated compute fabric configured to connect the computingdevices.
 9. The datacenter chamber of claim 1, wherein at least some ofthe racks are configured for front-side access, opposite the interiorchamber, for compute, network, and storage interfaces for the computingdevices mounted in the racks.
 10. The datacenter chamber of claim 1,wherein the chassis comprises bearings configured to at least partiallysupport and rotate against at least one of the racks during installationof the respective rack.
 11. The datacenter chamber of claim 1, whereinat least one of the racks is a wedge rack defining a generallywedge-shaped volume along at least one side of the rack and configuredto hold more than four computing devices.
 12. The datacenter chamber ofclaim 11, wherein the wedge rack comprises: a first articulating panelconfigured to selectively provide access to a rack of computing devices:a second articulating panel configured to selectively provide access toa first wedge-shaped volume on one side of the rack of computingdevices; and a third articulating panel configured to selectivelyprovide access to a second wedge-shaped volume on a second side of therack of computing devices.
 13. The datacenter chamber of claim 12,comprising a plurality of rectifier modules disposed in the firstwedge-shaped volume.
 14. The datacenter chamber of claim 1, furthercomprising: a plurality of bus bars disposed along the racks adjacentthe interior chamber; and a plurality of bus-bar braces coupledperpendicular to the bus bars.
 15. The datacenter chamber of claim 1,further comprising: a plurality of computing devices disposed in theracks, the computing devices having stored thereon operating systems andapplications executing within the operating systems.
 16. The datacenterchamber of claim 1, wherein the chassis comprises means for directingair to flow circumferentially inward or outward to cool the rack-mountedcomputing equipment.
 17. The datacenter chamber of claim 1, comprising:five or more wedge-shaped racks, each wedge-shaped rack beingsubstantially identical to the other wedge-shaped racks, the five ormore wedge shaped racks defining a cylinder having a base with five ormore sides corresponding to the interior volume, and the five or morewedge shaped racks extending more than five feet along the length of theinterior chamber, wherein: the chassis comprises a base comprising:means for leveling the base; means for reducing friction as awedge-shaped rack is translated over the base; the integrated coolingsystem comprises means for forcing air to flow over computing equipmentmounted in the wedge-shaped racks; and at least one of the five or morewedge-shaped racks comprises means for distributing direct current (DC)power to at least some of the computing equipment.